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CM Majhi lays stone for India’s 1st 3D chip packaging unit

Bhubaneswar: In a major step towards India’s semiconductor ambitions, Odisha Chief Minister Mohan Majhi on Sunday laid the foundation stone for 3D Glass Solutions Inc. (3DGS)’s advanced chip packaging facility at Info Valley in…
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ISRO invites VSSUT students to take part in contest for designing small satellite models

Bhubaneswar: Eight students from the Young Tinker Space Club of Veer Surendra Sai University of Technology (VSSUT), Burla, in Sambalpur district to participate in the Student CanSat Launch Competition 2024 by the Indian Space Research…
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