Bhubaneswar: Odisha is stepping up efforts to emerge as a major semiconductor hub, with Chief Minister Mohan Charan Majhi highlighting the state’s growing pipeline of semiconductor projects, investments and research initiatives at a press conference held on the sidelines of Semicon India 2026 in New Delhi on Friday.
Majhi said Odisha has received two of the 12 semiconductor projects approved under the India Semiconductor Mission — those of SiCSem Private Limited and 3D Glass Solutions (3DGS). Construction work on both projects has already begun, he said.
SiCSem is setting up a silicon carbide semiconductor fabrication and integrated packaging facility in Odisha, while 3DGS is establishing an advanced glass substrate packaging facility aimed at applications including artificial intelligence and high-performance computing. The foundation stone for the 3DGS facility was laid at Info Valley in Khordha in April 2026.
According to the Chief Minister, the Odisha government has approved five semiconductor projects involving an investment of around Rs 11,000 crore. These projects are expected to generate around 4,500 direct and 16,000 indirect jobs.
Majhi also highlighted investments by R.I.R Power Electronics, Sancode Technology and A.S.P Semicon. He said the silicon carbide wafer manufacturing facility established by R.I.R Power Electronics in Bhubaneswar is nearing completion and is expected to begin production soon.
The Chief Minister said the state is also pursuing further investments to expand its semiconductor ecosystem. He cited a memorandum of understanding between Intel and 3DGS, under which investments of around Rs 30,550 crore have been targeted, with the potential to create around 1,800 direct jobs.
The state is also working with SiCSem on a Phase-II project involving silicon carbide fabrication and packaging facilities, Majhi said.
He further announced that Odisha has approved a National Industry Co-Development Hub on Integrated Power Electronics in collaboration with IIT Bhubaneswar. The programme is expected to involve an investment of around Rs 452 crore from the Centre, state government and the research ecosystem, with Odisha contributing Rs 125 crore.
The initiative will facilitate the establishment of multiple centres of excellence with industry participation and focus on translating research and innovation into commercially viable technologies.
Majhi said Odisha is seeking to leverage the Union government’s Semicon 2.0 programme, which was approved in July 2026 with a total outlay of Rs 1,27,500 crore to strengthen India’s semiconductor design and manufacturing ecosystem.
Against this backdrop, the Odisha government has approved the third amendment to its semiconductor policy, providing an additional 25% capital expenditure support for projects approved under the India Semiconductor Mission. The state cabinet approved the policy amendment in August.
The Chief Minister said the revised policy is aimed at strengthening Odisha’s semiconductor and electronics manufacturing ecosystem and attracting further investment.
Majhi said he was participating in Semicon India 2026 with the objective of engaging with global companies and investors. He said representatives of around 10-12 companies from different countries would be engaged in discussions on investment opportunities in Odisha.
He also said the state’s semiconductor push could create more employment opportunities for highly educated youth in Odisha and contribute to the development of India’s domestic semiconductor ecosystem.
Semicon India 2026, being held in New Delhi from September 17 to 19, has brought together global semiconductor companies, investors, startups, policymakers and researchers. The event comes as India expands its semiconductor programme from manufacturing and packaging towards design, materials, equipment, research and talent development.